DIP316-001BLF

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Housing Material :: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

10140933-002LF

Amphenol Communication Solutions

HPCE RAR 2LP8HP2LP22S
10120872-008LF

Amphenol Communication Solutions

HPCE R/A RECT 40P20S
10028886-001LF

Amphenol Communication Solutions

CONN EDGE DUAL FMALE 44POS GOLD
10139821-010LF

Amphenol Communication Solutions

HPCE RAR 4HP2LP4HP24S
10124096-001LF

Amphenol Communication Solutions

CONN EDGE DUAL FEMALE 80POS

Part	Manufacturer	Stock	Description
DIP300T600P04	Chip Quik, Inc.	20	DIP-4 (0.3" BODY) TO DIP-4 (0.6"
DIP300T600P06	Chip Quik, Inc.	176	DIP-6 (0.3" BODY) TO DIP-6 (0.6"
DIP300T600P08	Chip Quik, Inc.	63	DIP-8 (0.3" BODY) TO DIP-8 (0.6"
DIP300T600P10	Chip Quik, Inc.	155	DIP-10 (0.3" BODY) TO DIP-10 (0.
DIP300T600P12	Chip Quik, Inc.	127	DIP-12 (0.3" BODY) TO DIP-12 (0.
DIP300T600P14	Chip Quik, Inc.	5	DIP-14 (0.3" BODY) TO DIP-14 (0.
DIP300T600P16	Chip Quik, Inc.	19	DIP-16 (0.3" BODY) TO DIP-16 (0.
DIP300T600P18	Chip Quik, Inc.	90	DIP-18 (0.3" BODY) TO DIP-18 (0.
DIP300T600P20	Chip Quik, Inc.	75	DIP-20 (0.3" BODY) TO DIP-20 (0.
DIP300T600P22	Chip Quik, Inc.	1,000	DIP-22 (0.3" BODY) TO DIP-22 (0.
DIP300T600P24	Chip Quik, Inc.	1,000	DIP-24 (0.3" BODY) TO DIP-24 (0.
DIP300T600P26	Chip Quik, Inc.	30	DIP-26 (0.3" BODY) TO DIP-26 (0.
DIP300T600P28	Chip Quik, Inc.	33	DIP-28 (0.3" BODY) TO DIP-28 (0.
DIP306-001BLF	Amphenol Communication Solutions	1,000	CONN IC DIP SOCKET 6POS GOLD
DIP314-001BLF	Amphenol Communication Solutions	1,000	CONN IC DIP SOCKET 14POS GOLD