Launch Date:
Bus Speed:
Embedded Options Available:
Max+V5:BU6 Memory Size (dependent on memory type):
Max # of Memory Channels:
Max Memory Bandwidth:
Sockets Supported:
TJUNCTION:
Package Size:
Idle States:
Thermal Monitoring Technologies:
Lithography:
Processor Base Frequency:
Enhanced Intel SpeedStep® Technology:
Intel® AES New Instructions:
Intel® Virtualization Technology (VT-x) ‡:
Image Part Manufacturer Description MOQ Stock Action
i3-3229Y AV8063801378000 SR12P SR0ZM Intel
Original Product
1
RFQ
5,000
In-stock
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D525 Intel
Original Product
1
RFQ
5,000
In-stock
Get Quote
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