Configurable TDP-down:
Max+V5:BU6 Memory Size (dependent on memory type):
Max Memory Bandwidth:
ECC Memory Supported ‡:
Graphics Base Frequency:
Max Resolution (eDP - Integrated Flat Panel)‡:
DirectX* Support:
# of Displays Supported ‡:
PCI Express Revision:
PCI Express Configurations ‡:
Max # of PCI Express Lanes:
Lithography:
Intel® InTru 3D Technology:
Intel® Optane Memory Supported ‡:
Intel® Thermal Velocity Boost:
Intel® Turbo Boost Technology ‡:
Intel® Hyper-Threading Technology ‡:
Intel vPro® Platform Eligibility ‡:
Intel® Software Guard Extensions (Intel® SGX):
Intel® Trusted Execution Technology ‡:
Intel® Stable IT Platform Program (SIPP):
Image Part Manufacturer Description MOQ Stock Action
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