Launch Date:
TDP:
Embedded Options Available:
Max+V5:BU6 Memory Size (dependent on memory type):
Max Memory Bandwidth:
ECC Memory Supported ‡:
Graphics Base Frequency:
# of Displays Supported ‡:
PCI Express Configurations ‡:
Max # of PCI Express Lanes:
Sockets Supported:
TJUNCTION:
Lithography:
Processor Base Frequency:
Intel® AES New Instructions:
Intel® Virtualization Technology for Directed I O (VT-d) ‡:
Image Part Manufacturer Description MOQ Stock Action
5Y10c FH8065802062002 SR23C Intel
Original Product
1
RFQ
5,000
In-stock
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5Y10 FH8065801879602 SR217 Intel
Original Product
1
RFQ
5,000
In-stock
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5Y10a FH8065801988602 SR218 Intel
Original Product
1
RFQ
5,000
In-stock
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i3-2340UE AV8062700849710 SR074 Intel
Original Product
1
RFQ
5,000
In-stock
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