Launch Date:
Bus Speed:
TDP:
Embedded Options Available:
Max+V5:BU6 Memory Size (dependent on memory type):
Max # of Memory Channels:
Max Memory Bandwidth:
PCI Express Revision:
PCI Express Configurations ‡:
Max # of PCI Express Lanes:
Sockets Supported:
Max CPU Configuration:
Instruction Set Extensions:
Thermal Monitoring Technologies:
Lithography:
Processor Base Frequency:
Intel® Turbo Boost Technology ‡:
Intel vPro® Platform Eligibility ‡:
Intel® AES New Instructions:
Image Part Manufacturer Description MOQ Stock Action
X3430 BV80605001914AG BX80605X3430 SLBLJ Q3AQ Intel
Original Product
1
RFQ
5,000
In-stock
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E5-2603V2 CM8063501375902 BX80635E52603V2 SR1AY Intel
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1
RFQ
5,000
In-stock
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E5-2609V2 CM8063501375800 BX80635E52609V2 SR1AX Intel
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1
RFQ
5,000
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E5-2407V2 CM8063401286600 BX80634E52407V2 SR1AK Intel
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1
RFQ
5,000
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E5-2403V2 CM8063401286702 BX80634E52403V2 SR1AL Intel
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1
RFQ
5,000
In-stock
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