Configurable TDP-down:
Embedded Options Available:
Max+V5:BU6 Memory Size (dependent on memory type):
Max # of Memory Channels:
ECC Memory Supported ‡:
Graphics Base Frequency:
Graphics Max Dynamic Frequency:
Max Resolution (DP)‡:
Max Resolution (eDP - Integrated Flat Panel)‡:
# of Displays Supported ‡:
PCI Express Revision:
Max # of PCI Express Lanes:
Lithography:
Intel® Optane Memory Supported ‡:
Intel® Hyper-Threading Technology ‡:
Intel® Transactional Synchronization Extensions:
Intel® Flex Memory Access:
Intel vPro® Platform Eligibility ‡:
Intel® Software Guard Extensions (Intel® SGX):
Intel® Trusted Execution Technology ‡:
Intel® Stable IT Platform Program (SIPP):
Image Part Manufacturer Description MOQ Stock Action
i3-9300 CM8068403377117 BX80684I39300 BXC80684I39300 Intel
Original Product
1
RFQ
5,000
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8380H Intel
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1
RFQ
5,000
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6328H Intel
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1
RFQ
5,000
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8354H Intel
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1
RFQ
5,000
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8376H Intel
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1
RFQ
5,000
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8376HL Intel
Original Product
1
RFQ
5,000
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8380HL Intel
Original Product
1
RFQ
5,000
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6328HL Intel
Original Product
1
RFQ
5,000
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