Configurable TDP-down:
Embedded Options Available:
Max+V5:BU6 Memory Size (dependent on memory type):
Max # of Memory Channels:
ECC Memory Supported ‡:
Graphics Video Max Memory:
Max Resolution (DP)‡:
Max Resolution (eDP - Integrated Flat Panel)‡:
Max Resolution (VGA)‡:
DirectX* Support:
OpenGL* Support:
# of Displays Supported ‡:
PCI Express Revision:
Max # of PCI Express Lanes:
Max CPU Configuration:
Lithography:
Intel® InTru 3D Technology:
Intel® Clear Video HD Technology:
Intel® Turbo Boost Technology ‡:
Intel® Hyper-Threading Technology ‡:
Intel® Transactional Synchronization Extensions:
Intel® Flex Memory Access:
Intel® Identity Protection Technology ‡:
Intel vPro® Platform Eligibility ‡:
Intel® AES New Instructions:
Intel® OS Guard:
Intel® Trusted Execution Technology ‡:
Intel® Stable IT Platform Program (SIPP):
Intel® Virtualization Technology for Directed I O (VT-d) ‡:
47 Records
Image Part Manufacturer Description MOQ Stock Action
N3000 FH8066501715915 Intel
Original Product
1
RFQ
5,000
In-stock
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x3-C3200RK Intel
Original Product
1
RFQ
5,000
In-stock
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x3-C3230RK Intel
Original Product
1
RFQ
5,000
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x5-Z8500 Intel
Original Product
1
RFQ
5,000
In-stock
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x7-Z8700 Intel
Original Product
1
RFQ
5,000
In-stock
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x3-C3405 Intel
Original Product
1
RFQ
5,000
In-stock
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x3-C3445 Intel
Original Product
1
RFQ
5,000
In-stock
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3 / 3 Page, 47 Records