Launch Date:
Bus Speed:
TDP:
Embedded Options Available:
Max+V5:BU6 Memory Size (dependent on memory type):
Max # of Memory Channels:
Sockets Supported:
Instruction Set:
Idle States:
Thermal Monitoring Technologies:
Lithography:
Intel® Hyper-Threading Technology ‡:
Enhanced Intel SpeedStep® Technology:
Image Part Manufacturer Description MOQ Stock Action
E2160 HH80557PG0331M BX80557E2160 BXC80557E2160 SLA8Z SLA92 SLA3H QYGD QYRG SLA9Z QYRJ Intel
Original Product
1
RFQ
5,000
In-stock
Get Quote
Z2760 Intel
Original Product
1
RFQ
5,000
In-stock
Get Quote
D525 Intel
Original Product
1
RFQ
5,000
In-stock
Get Quote
1 / 1 Page, 3 Records