- Manufacturer：
-
- Aavid (8)
- CUI Devices (7)
- Molex (1)
- T-Global Technology (48)
- Shape：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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68 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4.1W... |
8,000 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
4,000 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
10,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO92 |
25,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000 |
1,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
3,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1,500 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | 78030 EXTRUSION 2.36X... |
10 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1,500 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
3,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Molex | CHIP-SET COOLER #... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
3,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ANOD AL... |
1 |
50,378
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
89
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
197
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1 |
352
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
55
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
64
In-stock
|
Get Quote |
